Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

ABSTRACT

A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. 119(a) to KoreanApplication Nos. 10-2010-0121245 and 10-2011-0123017 filed on Dec. 1,2010 and Nov. 23, 2011, in the Korean intellectual property Office,which is incorporated herein by reference in its entirety set forth infull.

BACKGROUND

1. Field of the Invention

Embodiments of the present invention relate generally to a semiconductorpackage and a method for manufacturing the same, and more particularly,to a bonding structure of a semiconductor package including a stack-typesemiconductor package.

2. Description of the Related Art

As demand for miniaturization and high performance of electronicproducts increases in line with the increased demand for mobileproducts, the demand for a semiconductor memory with small size andlarge capacity has increased. One method for increasing storage capacityof a semiconductor memory includes mounting and assembling a pluralityof semiconductor chips in one semiconductor package. In this method,only a packaging process may be changed to increase the storage capacityof the semiconductor memory. Furthermore, increasing storage capacityhas a lot of advantages in terms of capital requirement, research anddevelopment, and development time. Therefore, semiconductor memorymanufacturers have made a variety of attempts to increase the storagecapacity of a semiconductor memory device through a multi-chip packagehaving a plurality of semiconductor chips mounted in one semiconductorpackage.

Methods of mounting a plurality of semiconductor chips in onesemiconductor package may include mounting a plurality of semiconductorchips in a horizontal direction and mounting a plurality ofsemiconductor chips in a vertical direction. Because of thecharacteristics of electronic products, to pursue miniaturization mostsemiconductor memory manufacturers prefer a stack-type multi-chippackage in which a plurality of chips are vertically stacked andpackaged. As an example of the stack-type multi-chip package, a packagestructure using through silicon vias (TSVs) has been proposed. Thepackage employing TSVs allows for a plurality of semiconductor chipsthat are physically and electrically coupled in a vertical directionthrough TSVs which are formed in the respective semiconductor chips at awafer level.

In a conventional stack-type package using TSVs, semiconductor chipshaving TSVs and a chip pad are electrically coupled through a bondingmetal such as solder. However, when the semiconductor chips are stackedusing TSVs, the TSVs are coupled through one signal and one link.Therefore, even though only one signal is cut, an open failure mayoccur. Accordingly, even though only one signal among several thousandsof signals is cut, it may lead to failure of the entire product.

SUMMARY

In one embodiment, a bonding structure of a semiconductor packageincludes: a first conductive member configured to transmit an electricalsignal; and a bonding pad configured to be electrically coupled to asurface of the first conductive member and comprising a plurality of subbonding pads.

The first conductive member may comprise a TSV. All or some of the subbonding pads may have different heights from each other.

The bonding structure may further include a bonding member provided onupper surfaces of the sub bonding pads and electrically coupling thefirst conductive member to a second conductive member.

The bonding member may fill spaces over the upper surfaces of the subbonding pads and spaces between the respective sub bonding pads.

The bonding member may include a plurality of sub bonding members eachformed on an upper surface of a sub bonding pad.

A part of the sub bonding pads may be configured to be electricallycoupled to a second conductive member, and another part of the subbonding pads may be configured to be electrically coupled to a thirdconductive member.

In another embodiment, a method for manufacturing a bonding structure ofa semiconductor package includes: forming a conductive member in asubstrate, the conductive member configured to transmit an electricalsignal; and forming a bonding pad configured to be electrically coupledto a surface of the conductive member and comprising a plurality of subbonding pads spaced from each other.

The method may further include forming a bonding member on an uppersurface of the bonding pad. The conductive member may comprise a TSV.The bonding member may comprise one of solder or an anisotropicconductive film.

The bonding member may include a plurality of sub bonding members eachformed on an upper surface of a sub bonding pad, where the plurality ofbonding members are spaced from each other.

The forming of the bonding pad may include: forming a photoresistpattern over the substrate, the photoresist pattern having a pluralityof openings spaced from each other; forming a conductive material layerby burying a conductive material in the openings; forming a solder layeron an upper surface of the conductive material layer; and removing thephotoresist pattern, and the sub bonding pads and sub bonding membersmay be simultaneously formed.

Forming the conductive material layer or the forming of the solder layermay be performed by electroless plating, electroplating, vacuumdeposition, sputtering, chemical vapor deposition (CVD), screenprinting, or dispensing.

The method may further include forming a seed layer over the substrate,before the forming of the photoresist pattern.

In another embodiment, a semiconductor package includes two or morestacked semiconductor chips, each semiconductor chip being configured totransmit an electrical signal and comprising a bonding pad comprising aplurality of sub bonding pads configured to be electrically coupled withan upper semiconductor chip among the semiconductor chips through atleast two or more sub bonding pads of a lower semiconductor chip.

Each semiconductor chip of the two or more stacked semiconductor chipsmay comprise a conductive member comprising the sub bonding pads andfurther comprising a TSV. All or some of the sub bonding pads may havedifferent heights.

The semiconductor package may further include a bonding member providedon upper surfaces of the sub bonding pads.

The bonding member may fill spaces over the upper surfaces of the subbonding pads and spaces between the respective sub bonding pads.

The bonding member may include a plurality of sub bonding members eachformed on an upper surface of a sub bonding pad.

A part of the sub bonding pads of the lower semiconductor chip may beconfigured to be electrically coupled to the upper semiconductor chip,and another part of the sub bonding pads of the lower semiconductorchips may be configured to be electrically coupled to another uppersemiconductor chip.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages will be moreclearly understood from the following detailed description taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance with anembodiment of the present invention;

FIG. 2 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance with anembodiment of the present invention;

FIGS. 3 to 7 are cross-sectional views illustrating a partialconstruction of a bonding structure of a semiconductor package inaccordance with an embodiment of the present invention;

FIGS. 8 to 10 are cross-sectional views illustrating a method formanufacturing a bonding structure of a semiconductor package inaccordance with an embodiment of the present invention; and

FIGS. 11 to 14 are cross-sectional views illustrating a stack-typesemiconductor package in accordance with an embodiment of the presentinvention.

DESCRIPTION OF SPECIFIC EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to accompanying drawings. However, the embodiments are forillustrative purposes only and are not intended to limit the scope ofthe invention.

FIG. 1 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance with anembodiment of the present invention.

Referring to FIG. 1, the bonding structure of the semiconductor packagein accordance with an embodiment of the present invention includes afirst conductive member 102 and a bonding pad 104 having a plurality ofsub bonding pads 104 a to 104 d. A bonding member 106 may exist on anupper surface of the bonding pad 104.

The first conductive member 102 may include a TSV, for example, butembodiments of the present invention are not limited thereto. Anyconductive members may be used as long as the conductive members have apad coupling. The first conductive member 102 may include one or moremetals selected from the group consisting of gold (Au), silver (Ag),copper (Cu), aluminum (Al), nickel (Ni), tungsten (W), titanium (Ti),platinum (Pt), palladium (Pd), tin (Sn), plumbum (Pb), zinc (Zn), indium(In), cadmium (Cd), chrome (Cr), and molybdenum (Mo), and one or morenitrides of the metals, polysilicon, and a conductive organic material.The first conductive member 102 may have a single layer structure ormultilayer structure. The polysilicon may be doped with impurities toimprove conductance.

The bonding pad 104 includes the plurality of sub bonding pads 104 a to104 d which may be electrically coupled to one surface (upper surface)of the first conductive member 102 and spaced from each other. Betweenthe respective sub bonding pads 104 a to 104 d, an empty space exists.FIG. 1 illustrates four sub bonding pads 104 a to 104 d, but this isonly an example. The bonding pad 104 may include two or more sub bondingpads. The sub bonding pads 104 a to 104 d may include one or more metalsselected from the group consisting of Au, Ag, Cu, Al, Ni, W, Ti, Pt, Pd,Sn, Pb, Zn, In, Cd, Cr, and Mo, and one or more of the metals,polysilicon, and a conductive organic material. The sub bonding pads 104a to 104 d may have a single layer structure or a multilayer structure.The polysilicon may include impurity-doped polysilicon.

The bonding member 106 may include a plurality of sub bonding members106 a to 106 d that may be formed on respective upper surfaces of thesub bonding pads 104 a to 104 d. The sub bonding members 106 a to 106 dmay be uncoupled, that is, the sub bonding members 106 a to 106 d may bespaced from each other. The sub bonding members 106 a to 106 d may beformed of a metal having a low fusing point, such as solder. The subbonding members 106 a to 106 d may comprise an Sn—Pb-based alloy solder,an Sn—Pb—Ag-based alloy solder, or an SAC (Sn—Ag—Cu)-based alloy solder,but an embodiment of the present invention is not limited to thematerial of the sub bonding members 106 a to 106 d.

In the bonding structure in accordance with an embodiment of the presentinvention, one conductive member is coupled to a plurality of subbonding pads so as to couple one signal through a plurality of contacts.Therefore, if the coupling of one or more sub bonding pads is opened,the signal coupling may be achieved through other sub bonding pads thatremain coupled to the conductive member. Accordingly, a fail rate of thesignal coupling may be significantly reduced, and bonding reliabilitymay be increased.

FIG. 2 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance with anembodiment of the present invention.

Referring to FIG. 2, the bonding structure of the semiconductor packagein accordance with the embodiment of the present invention includes afirst conductive member 102 and a bonding pad 104 having a plurality ofsub bonding pads 104 a to 104 d, as in the above-described embodiment ofthe present invention. However, a bonding member 106 existing on uppersurfaces of the sub bonding pads 104 a to 104 d may have a structurethat is not separated, that is, the bonding member 106 may be formed asone bonding member. The bonding member 106 may be formed of a metalhaving a low fusing point, such as solder. The bonding member 106 mayinclude Sn—Pb-based alloy solder, Sn—Pb—Ag-based alloy solder, or SAC(Sn—Ag—Cu)-based alloy solder, but embodiments of the present inventionare not limited to the material of the bonding member 106.

FIG. 3 is a cross-sectional view illustrating a bonding structure of asemiconductor package in accordance with another embodiment of thepresent invention.

Referring to FIG. 3, the bonding structure of the semiconductor packagein accordance with an embodiment of the present invention includes afirst conductive member 102 and a bonding pad 104 having a plurality ofsub bonding pads 104 a to 104 d. The bonding structure may furtherinclude a bonding member comprised of an anisotropic conductive film 108formed on upper surfaces of the sub bonding pads 104 a to 104 d. Sincethe first conductive member 102 and the bonding pad 104 comprising theplurality of sub bonding pads 104 a to 104 d have been already describedabove, the further detailed descriptions thereof are omitted.

The anisotropic conductive film 108 may comprise conductive particlesP1. When the temperature and pressure are raised, an electric contact isachieved by the conductive particles P1. The conductive particles P1 mayinclude metal particles comprising nickel, solder, silver or the like,or carbon particles, or plastic particles such as polystyrene or epoxyresin coated with a metal layer, or conductive particles coated withinsulation resin, or other conductive particles comprised of conductivematerial. The anisotropic conductive film 108 may comprise an adhesivematerial that may allow for adhering the bonding pad 104 to theanisotropic conductive film 108. The adhesive material may comprise oneor more materials selected from the polyethylene or polypropylene-basedthermoplastic resin, epoxy, polyurethane, or acryl-based thermosettingresin, and UV curable resin may be used, but the types of adhesivematerials that may be used is not limited thereto. Furthermore, theanisotropic conductive film 108 may contain insulation particles P2.

FIGS. 4 and 5 are cross-sectional views illustrating a partialconstruction of a bonding structure of a semiconductor package inaccordance with an embodiment of the present invention.

Referring to FIGS. 4 and 5, the bonding structure of the semiconductorpackage in accordance with an embodiment of the present inventionincludes a first conductive member 102 and a bonding pad 104 having aplurality of sub bonding pads 104 a to 104 d. The bonding structure mayfurther include a bonding member 106 formed on upper surfaces of thebonding pad 104 and having a plurality of sub bonding members 106 a to106 d. Since the first conductive member 102 has been described above,further detailed descriptions thereof are omitted.

The bonding pad 104 includes the plurality of sub bonding pads 104 a to104 d as illustrated in various embodiments of FIGS. 1 to 3, but in anembodiment depicted in FIG. 4 all or some of the sub bonding pads 104 ato 104 d may have different heights. For example, the first and fourthsub bonding pads 104 a and 104 d may be taller than the second and thirdsub bonding pads 104 b and 104 c, the first and fourth sub bonding pads104 a and 104 d may have a substantially similar height, and the secondand third sub bonding pads 104 b and 104 c may have a substantiallysimilar height. An embodiment depicted in FIG. 5 comprises a bondingmember 106 that may be substantially in contact with sub bonding pads104 a and 104 d.

FIG. 6 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance withanother embodiment of the present invention.

Referring to FIG. 6, the bonding structure of the semiconductor packagein accordance with an embodiment of the present invention includes afirst conductive member 102 and a bonding pad 104 having a plurality ofsub bonding pads 104 a to 104 d. Furthermore, a bonding member 106 maybe formed on the upper surface of the bonding pad 104. The bondingmember 106 may serve as an electrical and physical coupling to a secondconductive member (not depicted). The bonding member 106 may be formedin such a manner as to fill spaces over the upper surfaces of the subbonding pads 104 a to 104 d, and spaces between the sub bonding pads 104a and 104 d. If the bonding member 106 is formed of solder, the spacesmay be filled by a reflow process.

FIG. 7 is a cross-sectional view illustrating a partial construction ofa bonding structure of a semiconductor package in accordance withanother embodiment of the present invention.

Referring to FIG. 7, a first bonding pad 104 having a plurality of subbonding pads is formed over a first conductive member 102. A part orsome of the sub bonding pads comprising the first bonding pad 104 may beelectrically coupled to a second conductive member 202 through a firstbonding member 106. Another portion of the sub bonding pads comprisingthe first bonding pad 104 may be electrically coupled to a thirdconductive member 302 through the first bonding member 106. The firstconductive member 102, the second conductive member 202, and the thirdconductive member 302 may include TSVs. The first conductive member 102may be formed in a first chip, and the second and third conductivemembers 202 and 302 may be formed in a second chip stacked over thefirst chip. In this way it may be said that a lower semiconductor chipmay be electrically coupled with an upper semiconductor chip. Or,vice-versa, an upper semiconductor chip may be electrically coupled witha lower semiconductor chip. In an embodiment of the present invention,one signal of a conductive member (such as 102 in FIG. 7) is transferredto two or more conductive members (such as the second and thirdconductive members 202, 302 in FIG. 7 that are coupled to the firstconductive member 102). However, the number of conductive membersreceiving a signal is not limited to two according to an embodiment ofthe present invention. For example, the conductive member 102 in FIG. 7may be configured to be connected with any plural number of conductivemembers to transfer the signal.

FIGS. 8 to 10 are cross-sectional views illustrating a method formanufacturing a bonding structure of a semiconductor package inaccordance with an embodiment of the present invention.

Referring to FIG. 8, a conductive member 102 is formed in asemiconductor substrate 100, and photoresist is applied onto the uppersurface of the substrate 100 and patterned through exposure anddevelopment to form a photoresist pattern 110 having a plurality ofopenings V with a predetermined shape. The conductive member 102 mayinclude a structure with a predetermined shape, such as a TSV, which iselectrically conducted. Before the photoresist is applied, a stressbuffer layer for relieving a stress may be further formed on an uppersurface of the substrate 100. If the openings V are filled byelectroplating, then a process of forming a seed layer throughsputtering, vacuum deposition, or electroless plating may be furtherperformed.

Referring to FIG. 9, a plurality of conductive material layers andsolder layers are sequentially formed to fill the openings V. Theconductive material layers filling the openings V form a plurality ofsub bonding pads 104 a to 104 d, and the solder layers form a pluralityof sub bonding members 106 a to 106 d. The conductive material layersfor forming the sub bonding pads 104 a to 104 d and the solder layersfor forming the sub bonding members 106 a to 106 d, which fill theopenings V, may be formed by electroless plating, electroplating, vacuumdeposition, sputtering, chemical vapor deposition (CVD), screenprinting, or dispensing.

For example, the openings may be filled by Cu electroplating. In thiscase, a seed metal layer may be formed before performing the Cuelectroplating process. An electroplating solution, which is used duringthe Cu electroplating, may include, inter alia, a Cu ion source,sulphuric acid (H₂SO₄) for controlling conductance, and hydrochloricacid (HCl) for controlling a reduction. The electroplating solution mayfurther include additional agents. For example, when CuSO₄ serving as aCu ion source is put into H₂SO₄ and water, CuSO₄ is decomposed into Cu²⁺ions and SO₄ ²⁻ ions. After the Cu electroplating, gold electroplatingmay be further performed to improve the electrical characteristics.However, electroplating gold directly on Cu with no intermediate layertherebetween could cause some limitations to improving the overallconductivity. This is because when gold is electroplated directly on Cu,the gold and Cu elements tend to move toward each other, which actsagainst improving the conductance through gold plating. Therefore,nickel plating may be performed before the gold electroplating.

A plating solution for the gold electroplating may include chloroaurateor gold sulfite as a gold source and a cyanide-based ornon-cyanide-based compound as a chelating agent. According to anembodiment of the present invention, it is possible to use the platingsolutions other than chloroaurate or gold sulfite for the goldelectroplating. The process of forming a nickel layer through nickelelectroplating is not limited. For example, a solution includingNiSO₄.6H₂O (120˜230 g/L), NiCL₂ (5˜35 g/L), and H₃PO₄ (5˜35 g/L) may beused; or a solution including NiSO₄.6H₂O (120˜230 g/L), Na₄Cl (10˜30g/L), and ZnSO₄·7H₂O (20˜50 g/L) may be used. The nickel layer may beformed under a condition of a solution temperature of 25 to 50° C. andpH 4˜7, but it is not limited thereto according an embodiment of thepresent invention.

According to an embodiment of the present invention, metal paste may beburied in the openings V by screen printing and then dried and baked toform conductive material layers having a conductive material buriedtherein. Or, a conductive material may also be buried in the openings byan electroless plating or CVD process. Specifically, tungsten (W),titanium (Ti), tungsten nitride, or titanium nitride may be buried by aCVD process.

Referring to FIG. 10, the photoresist pattern 110 is removed to form abonding pad 104 having the plurality of sub bonding pads 104 a to 104 dand a bonding member 106 having the plurality of sub bonding members 106a to 106 d. The sub bonding members 106 a to 106 d may be formed ofsolder and may be reflowed through a reflow process, thereby forming thestructure as illustrated in FIG. 1.

The above description relating to manufacturing a bonding structure of asemiconductor package is described in accordance with an embodiment ofthe present invention, but it should be readily understood that othervariations are possible. For example, the bonding pad 104 and thebonding member 106 may be formed separately. In this case, the bondingmember 106 may not be a bonding member having a plurality of sub bondingmembers spaced from each other, but may be one bonding member which isnot separated. Furthermore, the bonding pad 104 may be formed by asemiconductor thin film or thick film formation technology, and ananisotropic conductive film may be used as the bonding member 106.

FIGS. 11 to 14 are cross-sectional views illustrating a stack-typesemiconductor package in accordance with an embodiment of the presentinvention.

Referring to FIG. 11, the stack-type semiconductor package 400 inaccordance with an embodiment of the present invention includes a firstchip 410 and a second chip 420 which are stacked and electricallycoupled to each other through a bonding member comprising sub bondingmembers 106 a to 106 d. The first chip 410 includes a first conductivemember 412 and a first bonding pad 104. The second chip 420 includes asecond conductive member 422 and a second bonding pad 124. A third chip(not illustrated), which may be additionally stacked over the secondchip 420, may be coupled through a second bonding member 126.

Each of the first conductive member 412 and the second conductive member422 may be formed with a TSV when needed. Any conductive structureshaving a pad coupling may be used as the first and second conductivemembers 412 and 422.

The first bonding pad 104 is electrically coupled to a surface (e.g., anupper surface) of the first conductive member 412, and may include aplurality of sub bonding pads 104 a to 104 d spaced from each other.FIG. 11 illustrates a case in which the first bonding pad 104 includesfour sub bonding pads 104 a to 104 d. However, this is only an example,and the first bonding pad 104 may include two or more sub bonding pads.The second bonding pad 124 may include a plurality of sub bonding pads,like the first bonding pad 104.

Since the conductive members 412 and 422, the bonding pads 104 and 124,and the bonding members 106 and 126 have been already described above indetail, further detailed descriptions thereof are omitted.

FIG. 11 illustrates a stack-type package employing the bonding structureillustrated in FIG. 1. Embodiments of the bonding structures illustratedin FIGS. 2 to 7 may also be used to implement a stack-type package inaccordance with an embodiment of the present invention.

FIG. 12 is a cross-sectional view of a stack-type package employing thebonding structure illustrated in FIG. 2. Just as in FIG. 2, the bondingmembers 106 and 126 of FIG. 12 may be formed as a single piece, that is,the bonding members 106 and 126 may each be formed as one bonding memberwhich is not separated.

FIG. 13 is a cross-sectional view of a stack-type package employing thebonding structure illustrated in FIG. 3. Just as in FIG. 3, the bondingmembers of FIG. 13 may comprise an anisotropic conductive film 108.

FIG. 14 is a cross-sectional view of a stack-type package employing thebonding structure illustrated in FIG. 7. FIG. 14 illustrates a case inwhich a part of the sub bonding pads is electrically coupled to a secondconductive member 202 through the first sub bonding member 106 a, andanother part of the sub bonding pads is electrically coupled to a thirdconductive member 302 through the fourth sub bonding member 106 d.

In FIGS. 12 to 14, the structures of the stack-type packages excludingthe bonding pad and the bonding member of FIG. 11 are identical to eachother, and thus further detailed descriptions thereof are omitted.Furthermore, although not illustrated, stack-type packages employing thebonding structures illustrated in FIGS. 4 to 6 may be applied.

Embodiments of the present invention have been disclosed above forillustrative purposes. Those skilled in the art will appreciate thatvarious modifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the invention as disclosed in theaccompanying claims.

What is claimed is:
 1. A bonding structure of a semiconductor package,comprising: a first conductive member configured to transmit anelectrical signal; and a bonding pad configured to be electricallycoupled to a surface of the first conductive member and comprising aplurality of sub bonding pads, wherein all of the sub bonding pads havedifferent heights from each other, wherein a part of the sub bondingpads is configured to be electrically coupled to a second conductivemember, and another part of the sub bonding pads is configured to beelectrically coupled to a third conductive member.
 2. The bondingstructure of claim 1, wherein the first conductive member comprises athrough-silicon via (TSV).
 3. The bonding structure of claim 1, furthercomprising a bonding member provided on upper surfaces of the subbonding pads and electrically coupling the first conductive member to asecond conductive member.
 4. The bonding structure of claim 3, whereinthe bonding member fills spaces over the upper surfaces of the subbonding pads and spaces between the respective sub bonding pads.
 5. Thebonding structure of claim 3, wherein the bonding member comprises aplurality of sub bonding members, each sub bonding member formed on anupper surface of a corresponding one of the sub bonding pads.
 6. Amethod for manufacturing a bonding structure of a semiconductor package,comprising: forming a conductive member in a substrate, the conductivemember is configured to transmit an electrical signal; and forming abonding pad configured to be electrically coupled to a surface of theconductive member and comprising a plurality of sub bonding pads spacedfrom each other, wherein all of the sub bonding pads have differentheights, wherein a part of the sub bonding pads is configured to beelectrically coupled to a second conductive member, and another part ofthe sub bonding pads is configured to be electrically coupled to a thirdconductive member.
 7. The method of claim 6, wherein, the conductivemember comprises a TSV.
 8. The method of claim 6, further comprisingforming a bonding member on an upper surface of the bonding pad.
 9. Themethod of claim 8, wherein, the bonding member comprises a solder or ananisotropic conductive film.
 10. The method of claim 8, wherein, thebonding member comprises a plurality of sub bonding members, whereineach sub bonding member is formed on an upper surface of a correspondingone of the sub bonding pads, which are spaced apart from each other. 11.The method of claim 10, wherein the bonding pad comprises: forming aphotoresist pattern over the substrate, the photoresist pattern having aplurality of openings spaced apart from each other; forming a conductivematerial layer by burying a conductive material in the openings; forminga solder layer on an upper surface of the conductive material layer; andremoving the photoresist pattern, and the sub bonding pads and subbonding members are simultaneously formed.
 12. The method of claim 11,further comprising: forming the conductive material layer comprises oneor more of electroless plating, electroplating, vacuum deposition,sputtering, chemical vapor deposition (CVD), screen printing, anddispensing; and forming the solder layer comprises one or more ofelectroless plating, electroplating, vacuum deposition, sputtering,chemical vapor deposition (CVD), screen printing, and dispensing. 13.The method of claim 11, further comprising forming a seed layer over thesubstrate, before the forming of the photoresist pattern.
 14. Asemiconductor package comprising two or more stacked semiconductorchips, each semiconductor chip being configured to transmit anelectrical signal and comprising a bonding pad comprising a plurality ofsub bonding pads configured to be electrically coupled with an uppersemiconductor chip among the semiconductor chips through at least two ormore sub bonding pads of a lower semiconductor chip, wherein all of thesub bonding pads have different heights, wherein a part of the subbonding pads is configured to be electrically coupled to a secondconductive member, and another part of the sub bonding pads isconfigured to be electrically coupled to a third conductive member. 15.The semiconductor package of claim 14, wherein each semiconductor chipof the two or more stacked semiconductor chips comprises a conductivemember comprising the sub bonding pads and further comprising a TSV. 16.The semiconductor package of claim 14, further comprising a bondingmember provided on upper surfaces of the sub bonding pads and configuredto electrically couple the stacked semiconductor chips.
 17. Thesemiconductor package of claim 16, wherein the bonding member fillsspaces over the upper surfaces of the sub bonding pads and spacesbetween the respective sub bonding pads.
 18. The semiconductor packageof claim 16, wherein the bonding member comprises a plurality of subbonding members each formed on an upper surface of a sub bonding pad.19. The semiconductor package of claim 14, wherein at least two subbonding pads of the lower semiconductor chip is configured to beelectrically coupled to the upper semiconductor chip, and another partof the sub bonding pads of the lower semiconductor chips is configuredto be electrically coupled to another upper semiconductor chip.